Thibault Buisson

Thibault Buisson

Title of talk: Trends in 3DIC

Thibault is a member of the Advanced Packaging team at Yole Développement. After his studies he joined NXP semiconductors as R&D process engineer in the thermal treatment area to develop CMOS technology node devices from 65 to 45nm. Afterwards, he joined IMEC Leuven and worked for more than 5 years as process integration engineer in the field of 3D technology. During this time, he has worked on several topics from TSV to micro-bumping and stacking.