Organization
Organizing Committee
Paul Franzon / NCSU: paulf@ncsu.edu
Phil Garrou / MCNC: philgarrou@att.net
P. Ramm / Fraunhofer EMFT
Eric Beyne / IMEC
M. Koyanagi / Tohoku Univ
Program Committee
USA:
Paul Franzon / NCSU: paulf@ncsu.edu
Phil Garrou / MCNC: philgarrou@att.net
James Lu / RPI: luj@rpi.edu
Sachin Sapatnekar / UMN: sachin@umn.edu
Dan Radack / IDA: drradick@ida.org
Craig Keast / MIT-LL: keast@ll.mit.edu
Jeff Burns / IBM: jburns@us.ibm.com
Len Schaper / U.Arkansas: len.schaper@eseus.com
Rao Tummala / Ga Tech: rao.tummala@ee.gatech.edu
Paul Enquist / Ziptronix: p.enquist@ziptronix.com
Bob Patti / Tezzaron: rpatti@tzzaron.com
Pat Morrow / Intel: patrick.morrow@intel.com
Yuan Xie / PSU: yuan.xie@cse.psu.edu
Rakesh Patel / Altera: rpatel@altera.com
Larry Smith / Sematech: larry.smith@sematech.org
Soha Hassoun / Tufts University: prof.hassoun@gmail.com
Tanay Karthik / Intel: tanay.karthik@intel.com
Europe:
Peter Ramm / Fraunhofer EMFT: Peter.Ramm@emft.fraunhofer.de
Eric Beyne / IMEC: eric.beyne@imec.be
Fred Roozeboom / Eindhoven Univ. of Technology: f.roozeboom@tue.nl
Ahmed Jerraya / CEA-LETI: ahmed.jerara@cea.fr
Nicolas Sillon / CEA Grenoble: nicolas.sillon@cea.fr
Klaus Pressel / Infineon: klaus.pressel@infineon.com
Maaike Taklo / SINTEF Oslo: MaaikeMargrete.VisserTaklo@SINTEF.no
Benedetto Vigna, GM STM: benedetto.vigna@st.com
Rolf Aschenbrenner / Fraunhofer IZM Berlin: rolf.aschenbrenner@izm.fraunhofer.de
Alan Mathewson / Tyndall National Institute: Alan.Mathewson@tyndall.ie
Cristina Torregiani / Qualcomm: Cristina.Torregiani@qualcomm.com
Asia:
Masahiro Aoyagi / AIST, Japan: m-aoyagi@aist.go.jp
Tanemasa Asano / Kyushu Univ., Japan: asano@ed.kyushu-u.ac.jp
Takayuki Ezaki / Sony, Japan: Takayuki.Ezaki@jp.sony.com
Kang Wook Lee / Tohoku Univ., Japan: kriss@bmi.niche.tohoku.ac.jp
Kazuya Masu / Tokyo Institute of Tech., Japan: masu.k.aa@m.titech.ac.jp
Makoto Motoyoshi / Tohoku Microtec, Japan: motoyoshi@t-microtec.com
Makoto Nagata / Kobe Univ., Japan: nagata@cs.kobe-u.ac.jp
Takayuki Ohba / Tokyo Institute of Tech., Japan
Yasumitsu Orii / IBM, Japan: ORII@jp.ibm.com
Kenichi Osada / Hitachi, Japan: kenichi.osada.aj@hitachi.com
Kanji Otsuka / Meisei Univ., Japan: otsuka@ei.meisei-u.ac.jp
Shoso Shinguhara / Kansai Univ., Japan: shingu@kansai-u.ac.jp
Makoto Takamiya / Univ. of Tokyo, Japan: mtaka@iis.u-tokyo.ac.jp
Tetsu Tanaka / Tohoku Univ., Japan: ttanaka@lbc.mech.tohoku.ac.jp
Tsuyoshi Kida / Renesas: tsuyoshi.kida.pv@renesas.com
Kwangyoo Byun / Hynix, Korea: bkyo@hynix.com
Tae-Je Cho / Samsung, Korea: taeje.cho@samsung.com
Gusung Kim / Epworks, Korea: gkim@epworks.co.kr
Joungho Kim / KAIST, Korea: joungho@ee.kaist.ac.kr
Kuan-Neng Chen / Chiao Tung Univ., Taiwan: knchen@mail.nctu.edu.tw
Wei-Chung Lo / ITRI, Taiwan: lo@itri.org.tw
Doug Yu / TSMC, Taiwan: chyu@tsmc.com
Dim-Lee Kwong / IME, Singapore: kwongdl@ime.a-star.edu.sg
Chuan Seng Tang / Nangyan Univ., Singapore: TanCS@ntu.edu.sg
Qianwen Chen / Tsinghua Univ. China: chenqw@mail.tsinghua.edu.cn
Sponsoring Organizations:
Technical Co-Sponsors
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