Organization
IEEE 3D System Integration Conference
Technical Program Committee
This conference is the primary activity of the IEEE CPMT Technical Committee on 3DIC/TSV
Paul Franzon / NCSU
Phil Garrou / MCNC
P. Ramm / Fraunhofer EMFT
Eric Beyne / IMEC
M. Koyanagi / Tohoku Univ
Alan Mathewson / Tyndall National Institute
Cian O’Murchu / Tyndall National Institute
Program Committee
USA:
Paul Franzon / NCSU
Phil Garrou / MCNC
James Lu / RPI
Sachin Sapatnekar / UMN
Dan Radack / IDA
Craig Keast / MIT-LL
Jeff Burns / IBM
Paul Enquist / Ziptronix
Bob Patti / Tezzaron
Pat Morrow / Intel
Yuan Xie / PSU
Rakesh Patel / Altera
Larry Smith / Sematech
Rhett Davis / NCSU
Eren Kursun / IBM
Roko Radojcic / Qualcomm
Sung Kyu Lim / GA Tech
Tanay Karthik / Intel
Soha Hassoun / Tufts Uni
Zvi Or-Bach / Monolithic 3D
Muhannad Bakir / Ga Tech
Matthew Lueck / RTI
Aravind Dasu / ISI
Shivam Priyadarshi /NCSU
Rio Xiangyu Dong / Qualcomm
Cindy Yi / UMKC
Nagesh Vodralli / Allvia
Europe:
Peter Ramm / Fraunhofer EMFT
Eric Beyne / IMEC
Fred Roozeboom / Eindhoven Univ. of Technology
Ahmed Jerraya / CEA-LETI
Klaus Pressel / Infineon
Rolf Aschenbrenner / Fraunhofer IZM Berlin
Alan Mathewson / Tyndall National Institute
Cristina Torregiani / Infineon
Maaike M.V. Taklo / SINTEF
Patrick Leduc / CEA-LETI
Geert Van Der Plas / IMEC
Harry Hedler / Siemens
Markku Aberg / VTT
Adriana Lapadatu / Sensonor
Benedetto Vigna / STM Milano
Pascal Vivet / CEA-Leti
Dimitrios Velenis / IMEC
Asia:
Mitsumasa Koyanagi / Tohoku Univ., Japan
Masahiro Aoyagi / AIST, Japan
Morihiro Kada / ASET
Shigeru Kannari / ASET
Hirofumi Kobayashi / ASET
Tanemasa Asano / Kyushu Univ., Japan
Takayuki Ezaki / Sony, Japan
Kang Wook Lee / Tohoku Univ., Japan
Makoto Nagata / Kobe Univ., Japan
Takayuki Ohba / Tokyo Institute of Tech., Japan
Yasumitsu Orii / IBM, Japan
Fumiaki Yamada / IBM, Japan
Kenichi Osada / Hitachi, Japan
Kanji Otsuka / Meisei Univ., Japan
Shoso Shinguhara / Kansai Univ., Japan
Makoto Takamiya / Univ. of Tokyo, Japan
Tetsu Tanaka / Tohoku Univ., Japan
Tsuyoshi Kida / Renesas
Tae-Je Cho / Samsung, Korea
Joungho Kim / KAIST, Korea
Kuan-Neng Chen / Chiao Tung Univ., Taiwan
Wei-Chung Lo / ITRI, Taiwan
Doug Yu / TSMC, Taiwan
Chuan Seng Tan / Nangyan Univ., Singapore
Qianwen Chen / Tsinghua Univ. China
Dongkai Shangguan / NCAP China
Shoso Shinguhara / Kansai Univ., Japan
Sponsoring Organizations:
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