2014 3DIC

Thanks to all authors, invited speakers and attendees for making the 2014 IEEE International Conference on 3D System Integration (3D IC)  in Kinsale such a successful and interesting conference. See you in Sendai next year for more of this:

3D IC Technology: Through Silicon Vias (TSV), wafer thinning, wafer alignment, wafer bonding, wafer dicing, 3D IC process, monolithic 3D integration, heterogeneous 3D integration, Capacitive coupling, Inductive coupling, multilevel epitaxial growth, etc.

3D IC Circuits Technology: 3D SOC, 3D Memory, 3D Processor, 3D DSP, 3D FPGA, 3D RF and microwave/millimeter wave, 3D analog circuits, 3D Biomedical circuits etc.

3D Applications: imaging, memory, processors, communications, networking, wireless, biomedical etc.

3D Design Methodology: 3D CAD, 3D synthesis, 3D design flows, Signal and power integrity analysis and design in 3D, 3D thermal design and analysis, test and design for test; 3D mechanical stress and reliability design and analysis, etc.