Invited Speakers

Invited Talk 1

Thibault Buisson

Title of talk: Trends in 3DIC

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Invited Talk 2

Denis Dutoit

Title of talk: 3D System Design: opportunities, challenges, enabling solutions and methodologies.

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Invited Talk 3

Brendan Farley

Title of Talk: Recent innovations in FPGA silicon and packaging technology

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Invited Talk 4

Peter Schneider

Title of Talk: Design for 3D – the way from specification to a verified system”

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Invited Talk 5

Prof. John Goodacre,

Title of Talk: EUROSERVER: Riding the perfect storm

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Invited Talk 6

Steve Moffatt

Title for the Talk: Controlling Thermal Processing to Enable a 3D World

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Invited Talk 7

Kafil Razeeb

Title of Talk: Nanowire based Anisotropic Conductive Film for 3D Integration

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