2015 3DIC AUG. 31-SEP. 2, 2015 SENDAI, JAPAN / IEEE

Rump Session

Rump Session (Monolithic 3D vs. Multilithic 3D)



1 Moderator : Paul Franzon NCSU/USA
2 Panelist : Sung Kyu Lim Georgia Tech/USA
3 Panelist : Kazuyuki Higashi Toshiba/Japan
4 Panelist : Toshifumi Irisawa AIST/Japan
5 Panelist : Subramanian Iyer UCLA/USA
6 Panelist : Paul Enquist Ziptronix/USA
7 Panelist : Yasumitsu Orii IBM/Japan