Organization
Organization
IEEE 2015 International 3D Systems Integration Conference (3DIC 2015)
Local Organizing Committee
| Chair: | T. Tanaka / Tohoku Univ. |
| K-W. Lee / Tohoku Univ. | |
| T. Fukushima / Tohoku Univ. | |
| R. Egawa / Tohoku Univ. | |
| H. Kino / Tohoku Univ. |
Organizing Committee
- Asia:
- M. Koyanagi / Tohoku Univ.
J-H Kim / KAIST - USA:
- P. Franzon / NCSU
B. Patti / Tezzaron - Europe:
- P. Ramm / Fraunhofer EMFT Munich
E. Beyne / IMEC
Technical Program Committee
- Asia:
- Mitsumasa Koyanagi / Tohoku Univ., Japan
Joungho Kim / KAIST, Korea
Tetsu Tanaka / Tohoku Univ., Japan
Masahiro Aoyagi / AIST, Japan
Tanemasa Asano / Kyushu Univ., Japan
Takayuki Ezaki / Sony, Japan
Takuo Funaya / Renesas, Japan
Kazuyuki Higashi / Toshiba, Japan
Kang Wook Lee / Tohoku Univ., Japan
Kazuya Masu / Tokyo Institute of Tech., Japan
Makoto Motoyoshi / Tohoku Microtech, Japan
Makoto Nagata / Kobe Univ., Japan
Takayuki Ohba / Tokyo Institute of Tech., Japan
Yasumitsu Orii / IBM, Japan
Kanji Otsuka / Meisei Univ., Japan
Shoso Shingubara / Kansai Univ., Japan
Makoto Takamiya / Univ. of Tokyo, Japan
Tae-Je Cho / Samsung, Korea
Namseog Kim / SK Hynix, Korea
Young-Chang Joo / Seoul National Univ., Korea
Kuan-Neng Chen / National Chiao Tung Univ., Taiwan
Wei-Chung Lo / ITRI, Taiwan
Doug Yu / TSMC, Taiwan
Dim-Lee Kwong / IME, Singapore
Chuan Seng Tan / Nangyan Univ., Singapore
Qianwen Chen / Tsinghua Univ., China
Dongkai Shangguan / NCAP, China
- USA:
- Paul Franzon / NCSU
Bob Patti / Tezzaron
Phil Garrou / MCNC
James Lu / RPI
Sachin Sapatnekar / UMN
Dan Radack / IDA
Craig Keast / MIT-LL
Jeff Burns / IBM
Paul Enquist / Ziptronix
Pat Morrow / Intel
Yuan Xie / PSU
Rakesh Patel / Altera
Larry Smith / Sematech
Rhett Davis / NCSU
Eren Kursun / IBM
Roko Radojcic / Qualcomm
Sung Kyu Lim / GA Tech
Tanay Karnik / Intel
Soha Hassoun / Tufts Univ.
Zvi Or-Bach / Monolithic 3D
Muhannad Bakir / Ga Tech
Matthew Lueck / RTI
Aravind Dasu / ISI
Shivam Priyadarshi / Qualcomm
Rio Xiangyu Dong / Qualcomm
Cindy Yi / UMKC
Nagesh Vodralli / Allvia
Gamal Refai-Ahmed / xilinx
- Europe:
- Peter Ramm / Fraunhofer EMFT
Eric Beyne / IMEC
Fred Roozeboom / Eindhoven Univ. of Technology
Ahmed Jerraya / CEA-LETI
Klaus Pressel / Infineon
Rolf Aschenbrenner / Fraunhofer IZM Berlin
Alan Mathewson / Tyndall National Institute
Cian O'Murchu / Tyndall National Institute
Cristina Torregiani / Infineon
Maaike M.V. Taklo / SINTEF
Patrick Leduc / CEA-LETI
Geert Van Der Plas / IMEC
Harry Hedler / Siemens
Markku Aberg / VTT
Adriana Lapadatu / Sensonor
Benedetto Vigna / STM Milano
Pascal Vivet / CEA-Leti
Dimitrios Velenis / IMEC
Pascal Couderc /3D Plus
Rozalia Beica / Yole Developpement
