Invited Speakers
Invited Speakers
| 1 | Subramanian Iyer | University of California at Los Angeles/USA | Some Challenges in Scaling 3D ICs to a Broader Application Set |
|---|---|---|---|
| 2 | Robert Patti | Tezzaron Semiconductor/USA | Progress in 3D Integrated Circuits |
| 3 | Rozalia Beica | Yole Development/France | 3D Integration: Applications and Market Trends |
| 4 | Paul Franzon | North Carolina State University/USA | Computing in 3D |
| 5 | Isao Sugaya | Nikon/Japan | New Precision Wafer Bonding Technologies for 3DIC |
| 6 | Tomoharu Ogita | Sony/Japan | Technology and Overview of Sony’s 3D Stacked CMOS Image Sensor |
| 7 | Gamal Refai-Ahmed | Xilinx/USA | A Holistic View of Chip-Level Thermal Architecture from Heterogeneous Stacked Dice to System Level in Telecoms Applications |
| 8 | Joungho Kim | KAIST/Korea | Active Si Interposer for 3D IC Integrations |