Invited Speakers
Click speaker’s name for further information of invited speech.
Monolithic 3D as an alternative to advanced CMOS scaling: technology, design and architecture perspectives
Scientific Director
CEA-Leti
3D Integration Technologies For The Stacked CMOS Image Sensors
Senior manager, Research Division 2
Sony Semiconductor Solutions Corporation
Advances in Substrate Manufacturing for AI/HPC and 5G Packaging
President & CEO
BroadPak Corporation
Power-Performance Advantages of InFO Technology for Advanced System Integration
Technical Director, R & D
Taiwan Semiconductor Manufacturing Company Limited (TSMC)
Future Challenges to Packaging Technologies of High Bandwidth Memory
SK Hynix
Heat transfer in nanostructured Si and heat flux control technique
Associate Professor, Institute of Industrial Science
The University of Tokyo
Universal ADC for sensor applications
President
Tech Idea Co., Ltd.
Innovative bonding technology for 3D integration
Professor Emeritus, The University of Tokyo &
Professor, Meisei University
An Introduction to Marching Memory (MM)
Professor, Department of Information and Computer Science
Keio University
Future Directions for 3DIC Technology and Design
Cirrus Logic Distinguished Professor, Electrical and Computer Engineering, Director, Graduate Programs (EB2 3014B)
North Carolina State University (NCSU)
Special Session: IEEE ELECTRONICS PACKAGING AWARD 2020 Recipients Talk
Title TBA
Professor, New Industry Creation Hatchery Center, Tohoku University
Special Session: IEEE ELECTRONICS PACKAGING AWARD 2020 Recipients Talk
Fraunhofer’s Initial and Ongoing Contributions in 3D IC Integration
Head of Strategic Projects, Fraunhofer EMFT Research Institution for Microsystems and Solid State Technologies