Invited Speakers


Click speaker’s name for further information of invited speech.


Monolithic 3D as an alternative to advanced CMOS scaling: technology, design and architecture perspectives

Dr. Pascal Vivet

Scientific Director



3D Integration Technologies For The Stacked CMOS Image Sensors

Dr. Yoshihisa Kagawa

Senior manager, Research Division 2

Sony Semiconductor Solutions Corporation


Advances in Substrate Manufacturing for AI/HPC and 5G Packaging

Dr. Farhang Yazdani

President & CEO

BroadPak Corporation


Power-Performance Advantages of InFO Technology for Advanced System Integration

Dr. Chuei-Tang Wang

Technical Director, R & D

Taiwan Semiconductor Manufacturing Company Limited (TSMC)


Future Challenges to Packaging Technologies of High Bandwidth Memory

Dr. Ho-Young Son

SK Hynix


Heat transfer in nanostructured Si and heat flux control technique

Prof. Masahiro Nomura

Associate Professor, Institute of Industrial Science

The University of Tokyo


Universal ADC for sensor applications

Dr. Akira Matsuzawa


Tech Idea Co., Ltd.


Innovative bonding technology for 3D integration

Prof. Tadatomo Suga

Professor Emeritus, The University of Tokyo &

Professor, Meisei University


An Introduction to Marching Memory (MM)

Prof. Tadao Nakamura

Professor,  Department of Information and Computer Science

Keio University


Future Directions for 3DIC Technology and Design

Prof. Paul D. Franzon

Cirrus Logic Distinguished Professor, Electrical and Computer Engineering, Director, Graduate Programs (EB2 3014B)

North Carolina State University (NCSU)


Special Session: IEEE ELECTRONICS PACKAGING AWARD 2020 Recipients Talk

Title TBA

Dr. Mitsumasa Koyanagi

Professor, New Industry Creation Hatchery Center, Tohoku University


Special Session: IEEE ELECTRONICS PACKAGING AWARD 2020 Recipients Talk

Fraunhofer’s Initial and Ongoing Contributions in 3D IC Integration

Dr. Peter Ramm

Head of Strategic Projects, Fraunhofer EMFT Research Institution for Microsystems and Solid State Technologies