MultiMode Interconnect (MMI) is a technique to eliminate crosstalk by coding signals in the fundamental modes of propogation in a transmission wire bundle. Referred to as "Model Signaling" by Broyde and Chevalier, we have worked out a new form which only requres a CODEC at only one end of the transmission line bundle. It is this form we are currently pursuing. We have worked out techniques that make the solution usable in arbitrary channels. The images above show a 0.13 um chip implemented using MMI and the recovered output eye diagram.
By eliminating the need for adding spacing so as to mitigate crosstalk, MMI has the potential to halve the packaging area required for bussed interconnect structures. It can achieve similar speeds and power efficiencies as any other chip to chip interconnect scheme. It can also be backward implemented on many conventional package bus structures so as to reduce the crosstalk.
This work is supported by Intel and SRC.
Selected Publications:
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•Z. Yan, P.D. Franzon, K. Aygun, and H. Braunisch, “Circuit/channel co-design methodology for multimode signaling,” in Proc. ECTC, 2013. Paper
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H. Kim, C. Won, and P. Franzon, “Crosstalk cancelling multi-mode interconnect using transmitter encoding,” in Proc. TVLSI, 2013. Paper
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Z. Yan, C. Won, P. Franzon, K. Aygun, and H. Braunisch, “S parameter based multimode signaling,” in Proc. EPEPS, 2012 Paper
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•C. Won, P.D. Franzon, “A low power multimode interconnect for dense links with crosstalk cancellation,” (submitted)
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Y. Choi, H. Braunisch, K. Aygun, P. Franzon, “Multimode Transceiver for High-Density Interconnects: Measurement and Validation”, in Proc. 2010 ECTC, May, 2010.Y. Choi, C. Won, P.D. Franzon, H. Braunisch, and K. Aygun,“Multimode signaling on non-ideal channels,“ in IEEE EPEP 2008, Oct. 2008, pp. 51-54.
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Y. Choi, H. Braunish, K. Aygun and P.D. Franzon, “Analysis of inter-bundle crosstalk in multimodel signaling for high density interconnect,” in Proc. 2008 Electronic Components and Technology Conference, pp. 664-668, May 2008.