BOOKS

 

•  Smith and P. Franzon : Verilog Styles for Synthesis of Digital Systems , 2000, by Prentice Hall.

•  D. Doane and P. Franzon: Multichip Modules: Basics and Alternatives , 1993, by Van Nostrand Rheinhold.

•  J-D Cho and P.D. Franzon, High Performance Design Automation for Multi-Chip Modules and Packages , 1996, World Scientific.

 

BOOK CHAPTERS

 

•  P. Franzon, Chip-package Codesign, to appear in CRC Handbook on Design Automation

•  P. Franzon, Multichip Module Technology , to appear in the The Electronic Handbook, J. Whitaker (editor), (CRC Press), 1996.

•  S. Mehrotra and P. Franzon, Performance Driven Global Routing and Wiring Rule

G eneration for High Speed PCBs and MCMs , in Advanced Routing of Electronic

Modules, M. Pecht (editor), (Kluwer), 1995.

•  P. Franzon and Michael Steer: Tools and Techniques for the Design of High Speed

Multichip Modules }, Chapter 7 in Electronics Packaging Forum,Volume 3, J. Mor- ris (ed), 1993 by IEEE Press.

•  P. Franzon, Comparison of Reconfiguration Schemes for Defect Tolerant Mesh Arrays , in Defect and Fault Tolerance in VLSI Systems, Volume 2, V.K. Jain (editor), (Plenum), 1989.

•  M. Hatamian, L.A. Hornak, T. Little, S.K. Tewksbury and P. Franzon: Fundamen- tal interconnection issues in, Electronic Materials Handbook,Volume 1:Packaging, Article 1BA (ASM International), 1989, pages 1-11.

•  P. Franzon and S.K. Tewksbury: ‘Chip Frame' scheme for reconfigurable mesh- connected arrays, in Wafer Scale Integration II, R.M. Lea (editor), ( North Holl- and), 1988.

•  P.D. Franzon: Yield Modeling for Fault Tolerant VLSI ,in Systolic Arrays, W. Moore, A. McCabe and R. Urquhart (editors), (Adam Hilger), 1987.

 

JOURNAL PAPERS

 

•  P. Mehrotra, P. Franzon, “Optimal Chip Package Codesign for High Performance DSP,” to appear in IEEE Trans. Advanced Packaging.

 

•  M. Scheffler, P. Franzon, G. Troster, ‘A defect level vsersus cost system tradeoff for Electronics Manufacturing,' in IEEE Trans. Electronics Packaging Manufacturing, C. Vol. 27, 1, Jan 2004, pp. 67-76.

 

•  M.R. Stan, P.D. Franzon, S.C. Goldstein, J.C. Lach, M. Zigler, “Molecular Electronics: from devices and interconnect to circuits and architecture,” Proc. IEEE, 91(11), Nov. 2003, pp. 194-1957.

 

•  J.A. Palmer, J.F. Mullin, T. Usher, E. Grant, J.W. Eischen, A.I. Kingon, P.D. Franzon, “The Design and Characterization of a Novel Piezoelectric Transducer-Based Linear Motor,” IEEE Trans. Mechatronics, Vol. 9, No. 2, June 2004, pp. 392-398.

 

•  S. Mick, L. Luo, J. Wilson, P. Franzon, “Buried Bump and AC Coupled Interconnection Technology, IEEE Trans. Adv.Packaging, 27(1), Feb, 2004, pp. 121-125.

 

•  J.T. Schaffer, A. Glaser, S. Lipa , and P. Franzon, “Chip Package Codesign of a Triple DES Processor,'' IEEE Trans. Advanced Packaging, 27(1), Feb. 2004, pp. 194-202.

 

•  J.M. Tour, L. Cheng, D.P. Nackashi, Y. Yao, A.K. Flatt, S.K. St. Angelo, T.E. Mallouk, P.D. Franzon, “Nanocell Electronic Memories,” J. Am. Chem. Soc., 125, 13279-13282, 2003.

 

•  J. Xu, L. Luo, S. Mick, J. Wilson, P. Franzon, “AC Coupled Interconnect for Dense 3-D ICs,” accepted for publication in IEEE Transactions on Nuclear Science (TNS).

 

•  J.M. Seminario, et.al., “Clustering Effects on Discontinuous Gold Films,” accepted by the Journal of Nanoscience and Nanotechnology.

 

•  R. Mohan, M.J. Choi, S.E. Mick, F.P. har, K. Chandrasekar, A.C. Cangellaris, P.D. Franzon, M. Steer, “Casual Reduced-order Modeling of Distributed Structures in a Transient Circuit Simulator,” accepted by IEEE Trans. MTT.

 

•  A.K. Varma, A.W. Glaser, and P.D. Franzon, “CAD Flows for Chip-Package CoVerification,” accepted by IEEE Trans. Advanced Packaging.

 

•  D.P. Nackashi, C. Amsinck, P.D. Franzon, “Molecular Electronic Circuit and Circuit Elements,” submitted to IEEE Trans. Nano.

 

•  J.M. Tour, W.L. Van Zandt, C.P. Husband, S.M. Husband, L.S. Wilson, P.D. Franzon, D.P. Nackashi, “Nanocell logic gates for Molecular Computing,” IEEE Trans. Nano, 1(2), June 2002, pp. 100-109.

 

•  P. Mehrotra, P.D. Franzon, “Novel architecture for fast address lookups,” IEEE Communications Magazine, 40(11), November 2002, pp. 66-71.

 

•  James M. Tour, William L. Van Zandt, Christopher P. Husband, Summer M. Husband, Eric C. Libby, Derek A. Ruths, Kenneth K. Young and Lauren S. Wilson, Paul D. Franzon and David P. Nackashi, “Nanocell Logic Gates for Molecular Computing,” IEEE Transactions on Nanotechnollogy, 1(2), June 2002, pp. 100-109.

 

•  T. Usher, J. Manning, D. Dessent, J.A. Palmer, P. Franzon, E. Grant, and A. Kingon, “Load characterization of high displacement pizeoelectric actuators with various end conditions'', Sensors and Actuators-A-(Physical), Vol. A94, No.1-2, Oct. 2001. pp.19-24.

 

•  Meshel AS, Nackashi DP, Franzon PD, Sheetz MP, Single force measurements on 3D collagen matrix" Biophysical Journal 82(1): 2002 Part 2 Jan 2002.

 

•  S. Gahide, G.L. Hodge, W. Oxenham, A.M. Sayam and P.D. Franzon, “Micromachines and textiles: matching two industries", Textile Asia, August 2000, pp. 58-68.

 

•  H.L. Lo, J.F. Kauffmann and P.D. Franzon, “High frequency loss and electromagnetic field distribution for striplines and microstrips'', IEEE Transactions on Components, Packaging and Manufacturing Technology ,Part B., Advanced Packaging, Vol. 22, No. 1, pp. 16-25, Jan. 1999.

 

•  S.F. Al-sarawi, D. Abbott, and P. Franzon, “A review of 3D Packaging Technology'', IEEE Transactions on Components, Packaging and Manufacturing Technology , Feb. 1998, Vol. 21, No. 1, pp.2-14.

 

•  H.Y. Hseih, W. Liu, P. Franzon and R. Cavin III, ‘`Clocking Optimization and Distribution of Digital Systems with Scheduled Skews'', International Journal of VLSI Signal Processing , April 1997, Vol. 16., pp.19-36.

 

•  P. Franzon, Andrew Stanaski, Yusuf Tekmen, Sanjeev Banerjia,”System Design Optimization for MCM-D/Flip-Chip'', IEEE Trans. on Components Packaging and Manufacturing Technology , Part B, Vol. 18, 1995, No. 4, pp. 620-627.

 

•  S. Lipa, M.B. Steer, A.C. Cangellaris and P.D. Franzon, “Experimental Characterization of Transmission Lines in Thin-Film Multichip Modules,'' IEEE Trans. on Components Hybrids and Manufacturing Technology , Part A, Vol. 19, No. 1, Feb. 1996, pp. 74-82.

 

•  R.J. Evans and P.D. Franzon, Energy consumption modeling and optimization for SRAMs, IEEE Journal of Solid State Circuits , Vol. 30, no. 5, May 1995, pp. 571-579.

 

•  S. Mehrotra, Y. Tekmen, P. Franzon, and W. Liu, Stochastic Optimization Approach to Component Sizing for High Performance Circuits, Submitted for publication to IEEE Transactions on Computer-Aided Design.

 

•  S. Washabaugh, P.D. Franzon and H.T. Nagle, SABSA: Switching-Activity Based State Assignment , International Journal of High Speed Electronics and Systems , Vol. 5, No. 2 (1994),203-212.

 

•  M.S. Basel, M.B. Steer and P.D. Franzon , “Simulation of High Speed Interconnects

Using a Hierarchical Packaging Simulator,'' IEEE Trans. on Components Hybrids and

Manufacturing Technology/AdvancedPackaging .

 

•  Slobodan Simovich, Sharad Mehrotra, Paul Franzon and Michael Steer, Delay and Reflection Noise Macromodeling for Signal Integrity Management of PCBs and MCMs, in IEEE Trans. CPMT , Part B: Advanced Packaging, vol. 17, no. 1, Feb., 1994, pp. 15-21.

 

•  Doane and P. Franzon, The Case for MCMs, in Semiconductor International , April 1994, pp. 85--86.

 

 

•  S. Simovich, P.D. Franzon and M.B. Steer, Method for automated waveform analysis of transient in digital circuits, Electronics Letters , 15th April 1993, Vol. 29, No. 8, pp. 681 -693.

 

•  S. Lipa, M.B. Steer, A.S. Morris and P.D. Franzon, Comparison of methods for determining the capacitance of planar transmission lines with with application to multichip module characterization, IEEE Trans. on Components Hybrids and Manufacturing Technology/Advanced Packaging , May 1993.

 

•  S. Ma and P. Franzon: Energy Control in CMOS Buffers, IEEE Journal of Solid State Circuits , Vol. 29, No. 9, September 1994,pp. 1150--1153.

 

•  P. Franzon, and R. Evans,An MCM Design Process with Application to a Laptop Computer Design , April 1993, Vol. 26, No. 4, pp. 41--49, IEEE Computer Magazine .

 

•  Dalal, M. Lorenzetti, and P. Franzon, A Layout-Driven Yield Predictor and Fault Generator for VLSI , IEEE Trans . Semi. Manu.,February 1993 (Vol. 6, No. 1), pp. 77-82.

 

•  M.B. Steer, S.B. Goldberg and P.D. Franzon,”Comment on an accurate measurement technique for line properties, junction effects and dielectric and magnetic parameters,''

IEEE Trans. Microwave Theory Tech ., February 1992.

 

•  Steven B. Goldberg, Michael B. Steer, Paul D. Franzon, and Jeffrey S. Kasten Experimental electrical characterization of interconnects and discontinuities in high speed digital systems , IEEE Trans. CHMT , Vol. 14, No. 4, December 1991.pp. 761-765.

 

•  Van den Bout, P. Franzon, J. Paulos, T. Miller III, W. Snyder, T. Nagle and W. Liu: Scalable VLSI implementations for neural networks, Journal of VLSI Signal Processing , Volume 1, pp. 367-385, April, 1990.

 

•  P. Franzon: Modeling interconnect yield in reconfigurable circuits, Electronics Letters , Volume 25, Number 18, pages 1225 - 1226, 31 August 1989.

 

•  P. Franzon and K. Eshraghian: Achieving ULSI through defect tolerance, in the Int. J. of Computer Aided VLSI Design , Volume 1, Number 1, 1989, pages 73 - 90.

 

•  M. Hatamian, L.A. Hornak, T. Little, S.K. Tewksbury and P.Franzon:Fundamental interconnection issues, AT&T Technical Journal, July/August 1987 , Volume 66, Issue 4, pages 13 - 30.

 

•  S.K. Tewksbury, M. Hatamian, P. Franzon, L.A. Hornak, C.A. Siller,Jr., and V.B. Lawrence: FIR filters for high sample rate applications , IEEE Communications , Vol. 25, July 1987, pp. 62-72.

 

PEER REFEREED CONFERENCE PUBLICATIONS

 

•  A. Varma, A. Glaser, P. Franzon, “CAD flows for chip-package codesign,” Proc. IEEE Electrical Performance of Electronic Packaging,” Oct. 2003, pp. 11-14.

 

•  J.A. Palmer, J.F. Mulling, B. Dessent, E. Grant, J.W. Eischen, A. Gruverman, A. Kingon, P.D. Franzon, “The Design, Fabrication and Characterization of Millimeter Scale Motors for Miniature Direct Drive Robots,” Proc. IEEE International Conference on Robotics and Automation '04, April 2004, pp. 4668-4673.

 

•  M.R. Yuce, W. Liu, J. Damiano, B. Bharat, P.D. Franzon, N.S. Nugan, “A low power PSK receiver for space applications in 0.35 m m CMOS,” Proc. IEEE Custom Integrated Circuits Conference, Sept. 2003, pp. 155-158.

 

•  L. Zhang, W. Liu, R. Bashirullah, J. Wilson, and P. Franzon, "Simplified
delay design guidelines for on-chip global interconnects," GLSVLSI, proc.
of ACM, pp.29-32, April 2004.

 

•  A. Varma, A. Glaser, S. Lipa , M.Steer, P. Franzon, “The development of a macro-modeling tool to develop IBIS models,” Proc. IEEE Electrical Performance of Electronic Packaging, Oct. 2003, pp. 177-280.

 

•  Paul Franzon, Angus Kingon, Stephen Mick, John Wilson, Lei Luo, Karthik Chandrasakhar, Jian Xu, Salvatore Bonafede , Alan Huffman, Chad Statler, Richard LaBennett, Invited Paper , “High Frequency, High Density Interconnect Using AC Coupling,” Fall MRS Conference, Boston MA, December 2003.

 

•  Paul Franzon, Stephen Mick, John Wilson, Lei Luo, Karthik Chandrasakhar, Invited Paper, “AC Coupled Interconnect for High-Density High-Bandwidth Packaging” Proc. SPIE, Microlectronics: Design, Technology and Packaging, Perth , Australia , December 2003. pp 67-69.

 

•  Paul Franzon, Stephen Mick, John Wilson, Lei Luo, Karthik Chandrasakhar, Invited Paper, “AC Coupled Interconnect for High-Density High-Bandwidth Packaging,” Japan SSDM, Tokyo , Japan , September, 2003.

 

•  Jian Xu, Stephen Mick, John Wilson, Lei Luo, Karthik Chandrasakhar, Paul Franzon, “AC Coupled Interconnect for Dense 3-D Systems”, Proc. IEEE Conference on Nuclear Science and Imaging, Seattle Washington, October 2003.

 

•  P. Franzon, C. Amsinck, N. Di Spigna, Sachin Sonkusale , and D. Nackashi, “Integration for Molecular Electronics,” Invited Paper , Conference on Foundations of NanoScience, Snowbird, UT, April 2004.

 

•  M. Nakkar, P. Franzon, “Low power logical element for FPGA fabric,” IEEE Int. Conference on Microelectronics, Dec. 2002, pp. 55-57.

 

•  S. Mick, L. Luo, J. Wilson, P. Franzon, “Buried solder bump connections for high-density capacitive coupling,” IEEE Electrical Performance of Electronic Packaging, 2002, pp. 205-208.

 

•  P. Mehortra, P. Franzon, “ Binary Search Schemes for Fast IP Lookups,” IEEE Globecom, November, 2002, pp. 2005-2009.

 

•  S. Mick, P. Franzon, A. Huffman, Packaging Technology for AC Coupled Interconnection, IMAPS Flip-Chip Conference, July 2002.

 

•  P. Franzon, C.J. Amsinck, D.P. Nackashi, N. DeSpagna, “Scalable Molecular Circuit Architectures,” Invited Paper , 20h02 Engineering Foundation Conference on Molecular Computing, Key West, December 2002.

 

•  S.E. Mick, L. Luo, J.M. Wilson, P.D. Franzon, “Buried Solder Bump Connections for High-Density Capacitive Coupling,” IEEE Electrical Performance on Electornic Packaging, October, 2002.

 

•  S. E. Mick, J. M. Wilson, and P. Franzon, “4 Gbps AC Coupled Interconnection,” ( invited paper ), IEEE Custom Integrated Circuits Conference, May 12-16, 2002, pp. 133-140.

 

•  P. Mehortra, P. Franzon, “ Novel Hardware Implementation for Fast Address Lookups,” in 2002 Workshop on High Performance Switching and Routing, May 26-29, Kobe Japan.

 

•  P. Mehrotra, I. Baldine, D. Stevenson, and P. Franzon, “Network Processor Design for Optical Burst Switched Networks,” Proc. 14 th Annual IEEE International ASIC/SOC Conference, 2001., pp. 296-300.

 

 

•  J. Mulling, T. Usher, B. Desent, J. Palmer, P. Franzon, E. Grant, A. Kingon, “High displacement piezoelectric actuators: characterization at high load with controlled end conditions,” Proc. 12 th IEEE Int. Symp. On Applications of Ferroelectrics, 2000, pp. 745-748.

 

•  P. Franzon, “The Future of Molecular Electronics,” Panel Session, International Conference on Computer Aided Design of Integrated Circuits, 2001.

 

•  D. Nackashi and P. Franzon, “Moletronics: A circuit design perspective,” SPIE Smart Electronics and MEMS, International Conference in, Melbourne Australia , 2000, Proc. SPIE, Vol. 4236; 2000, pp.80-88.

 

•  John Wilson, Rizwan Bashirullah, David Nackashi, David Winick, Bruce Duewer, Paul D. Franzon, “Design of rotating MEMS tunable capacitors for use at RF and Microwave frequencies” , in Proc. SPIE International Symposium on Microelectronics and MEMS, 17 - 19 December 2001 Adelaide,  Australia.

 

•  B. Duewer, D. Winick, A. Oberhofer, J. Muth, P. Franzon, “Improving Interconnect Characteristics of Thin Film MEMS Processes,”, in Proc. SPIE International Symposium on Microelectronics and MEMS, 17 - 19 December 2001 Adelaide,  Australia.

 

•  J. Wood, S. Lipa, P. Franzon and M. Steer, “Multi-gigahertz low-power low-skew rotary clock scheme,” Proc. International Conference On Solid State Circuits, 2001, pp. 400-401, 470.

 

•  P. Mehrotra, V. Rao, T. Conte, P. Franzon, “Leveraging high density packaging for high performance DSP systems”, IEEE Electrical Performance on Electronic Packaging, 2000, pp. 25-28.

 

•  P.D. Franzon, B. Duewer, J. Wilson and D.A. Winick, "Programmable MEMS Capacitor Arrays", in Proc. SPIE Int. Symposium on Microelectronics and Micromechanical System s, November, 1999.

 

•  R. Pomerleau, G. Bilbro, and P. Franzon, “Improved delay prediction for on-chip buses,'' Proceedings 1999 Design Automation Conference (Cat. No. 99CH36361). IEEE , Piscataway , NJ , USA ; 1999; xxxii+1003 pp. p.497-501.

 

•  P. Franzon, “Accuracy Issues in Full-Chip Extraction'', Panel Session Chair and Organizer, DAC 1999.

 

•  P.D. Franzon, W. Lui, C. Gloster-C, T. Schaffer, A. Glaser, and A. Stanaski, "Infrastructure and course progression for complex IC design education," in Proceedings 1999 IEEE International Conference on Microelectronic Systems Education (MSE'99) `Systems Education in the 21st Century' (Cat.No.99-63794). IEEE Comput. Soc, Los Alamitos, CA, USA; 1999; x+104 pp.p.88-9.

 

•  Bruce Duewer, David Winick, John Wilson, Jeremy Palmer, Paul Franzon "Methodology for Design of Electrostatic MEMS Devices Using the SUMMiT Process", Proceedings of the 45th International Instrumentation Symposium , Albequerue, NM, May 1999, p511-520.

 

•  M. Nakkar, A.W. Glaser, P. Franzon, K. Williams, M. Roberson, G. Rinne, “Three Dimensional MCM Package Assembly and Analysis,'' in Proc. IEEE/IMAPS Conference on High Density Packaging and MCMS , Denver, CO., May 1999, pp. 188-192.

 

•  B.E. Duewer, J.M. Wilson, D.A. Winick, P. Franzon, “MEMS-based switches for Digital and RF Switching,'' in Proc. Advanced Research in VLSI , Atlanta GA, April 1999, pp.369-377.

 

•  Mouna Nakkar, Paul Franzon, John Harding, and David Schwartz, “Dynamically Programmable Cache, Evaluation and Virtualization'' in Proc. ACM/SIGDA FPGA 99, Feb. 1999, Monterey , CA , pp. 246.

 

•  Paul Franzon, “Design Automation and Design Challenges for Package/Systems,''

Invited paper, in Proc. IEEE Asia Design Automation Conference, Hong Kong , Jan. 1999, pp.372-.

 

•  T. Schaffer, A. Stanaski, A. Glaser, P. Franzon, "The NCSU Design Kit for IC Fabrication Through MOSIS,", Proc. 1998 International Cadence User Group Conference , Sept. 13-17, 1998, pp. 71-80. Won best paper award.

 

•  Mouna Nakkar, David G.Bentlage, John Harding, David Schwartz, Paul Franzon, and Thomas Conte,”Dynamically Programmable Cache,'' in Proc. SPIE Conference on Reconfigurable Computing , October, 1998, Boston MA, pp. 218-226.

 

 

•  S. Lipa, A.W. Glaser, P.D. Franzon, "Flip-chip Power Distribution", in Proc. Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on , Page(s): 39 -41

 

•  M.Azam, R. Evans, and P.D. Franzon, “Power Reduction by low activity datapath design and SRAM energy models'', in Proc. Workshop on Low Power Techniques , ISCA98, July 1998.

 

•  H-Y Hsieh, W. Lui, M. Clements, P. Franzon, “Self-calibrating clock distribution with scheduled skews,'' in Proc. ISCAS '98 , Volume: 2 ,Page(s): 470 -473 vol.2

 

•  S.P. Chaudhury and P.D. Franzon, “Accurate Lumped-Parameter modeling for dynamic simulation of electrostatic MEMS Actuators'', Proc. International Workshop on Modeling of MEMS Systems , April 1998.

 

•  J.T. Schaffer, S.Lipa, A. Glaser, P. Franzon, “Issues in Chip-Package Codesign with MCM-D/Flip-Chip Technology'', Proc. IEEE International Symposium on Chip-Package Codesign , Feb. 1998, pp 88-92.

 

•  Winick, B. Duewer, S. Chaudry, J. Wilson, J. Ticker, U. Eksi and P. Franzon, “MEMS-based diffractive optical beam steering system'', Proceedings SPIE , Vol 3276, pp. 81-87, February, 1998.

 

•  McClellan, K.J., Jr.; Wailes, T.S.; Franzon, P.D, “An accurate, computationally efficient crosstalk model for routing high-speed MCMs,'' in Proc. ASIC Conference and Exhibit , 1997, Page(s): 110 -114

 

•  K.J. McClellan, T.S. Wailes, and P.D. Franzon, “Simulation vs. Calculation of Crosstalk'', Proc. IEEE Topical Meeting on Electrical Performance of Electronic Packaging , Oct. 1997, pp.131-134.

 

•  Baribrata Biswas, Allen Glasser, Steven Lipa, Michael Steer, Paul Franzon, Dieter Griffis, Phillip Russell, “Experimental Electrical Characterization of On-Chip Interconnects'', accpeted by the IEEE Topical Meeting on Electrical Performance of Electronic Packaging , Oct. 1997, pp. 57-59.

 

•  A.W. Glaser, M. Nakkar, P.D. Franzon, T.M. Conte G. Rinne, M. Roberson, V. Rogers, C.K. Williams, “A Low-cost, High Performance Three-Dimensional Memory Module'', in Proc. IEEE Memory Technology, Design and Testing Workshop , August 1997.

 

•  Mouna Nakkar, Paul Franzon, A.W. Glaser, V Rogers, K.C. Willimas, and Glenn Rinne, “Thermal/mechanical analysis and design of three dimensional high density MCM package'', in Proc. Next Generation Package Design Workshop , June 11 1997.

 

•  M. Azam, P. Franzon, T. Conte, “Low Power Data Processing by Elimination of Redundant Computations'', in Proc. 1997 International Symposium on Low Power Electronics and Design, Aug 18--20th, Monterey, California, pp.259-264.

 

•  Glaser, A.; Nakkar, M.; Franzon, P.; Rinne, G.; Roberson, M.Rogers, V.; Williams, C.K.;“A low cost, high performance three-dimensional memory module'' , Proc. Int. Workshop Memory Technology, Design and Testing , 1997. Page(s): 2 -7.

 

•  D.A. Winick, B.E. Duewer, S. Palchaudhury and P.D. Franzon, “Performance Elvaluation of Micromechanical Binary Phase-Only Holographic Optical Elements'', in Proc. IEEE Electronic Technology and Components Conferenc , May 1997, pp. 419-424.

 

•  Toby Schaeffer, Alan Glaser, Steve Lipa and Paul Franzon, MCM Implementation of a Data Encryption Standard (DES) Processor ,in Proc. 1997 IEEE MCM Conference , Feb. 1997, pp.13-17.

 

•  Wes Hansford Jennifer Peltier, Paul Franzon, Steve Lipa, and Jonathan Schaeffer, MIDAS Flip-Chip Service , in Proc. 1997 IEEE MCM Conference , Feb. 1997,pp.133-135.

 

•  Paul D. Franzon, Tom Conte, Sanjeev Banerjia, Alan Glaser, Steve Lipa, Toby Schaffer, Andrew Stanaski and Yusuf Tekmen, Computer Design Strategy for MCM-D/Flip-Chip Technology, in Proceedings 1996 Topical Meeting on Electrical Performance of Electronic Packaging , Oct. 1996, pp.6-8..

 

•  Raj Lakhani, Craig Deutschle and Paul Franzon, High Speed Bus Design Using HSPICE Optimization Techniques Based on Worst Case Design Approach, in Proceedings 1996 Topical Meeting on Electrical Performance of Electronic Packagin g, Oct. 1996, pp.93-96.

 

•  P. Franzon, Computer Design Strategy for MCM-D/Flip-Chip Technology, Invited paper, in Proceedings 1996 ASIC Conference , Oct. 1996, pp35-39.

 

•  P. Franzon, System Design Optimization With Multichip Module Technology, Invited Paper , in Proceedings 1996 Conference of the Brazilian Microelectronics Society , July 1996.

 

•  Christoforos Harvatis, Yusuf C. Tekmen, Grif L. Bilbro, Paul D. Franzon, Pin Assignment for High-Performance MCM Systems, in Proceedings 1996 IEEE ISCAS Conference . pp. 771-774.

 

•  Sanjeev Banerjia, Alan Glaser, Christoforos Harvatis, Steve Lipa, Real Pomerleau, Toby Schaffer, Andrew Stanaski, Yusuf Tekmen, Grif Bilbro, and Paul Franzon, Issues in Partitioning Integrated Circuits for MCM-D/Flip-Chip Technology, in Proceedings 1996 IEEE MultiChip Module Conference .

 

•  P. Franzon, Optimal System Design with MultiChip Module Technology, Invited Paper , in Proceedings of Microeletronics'95.

 

•  A.W. Glaser, M.B. Steer and P.D. Franzon, Measurement of on-IC Capacitance Structures, in Proceedings 1995 IEEE Topical Meeting on Electrical Performance of Electronic Packaging .

 

•  Winick, M. Teague, and P. Franzon, A Micro-machined Approach to Optical Interconnect, in Proc. 1995 Electronic Components and Technology Conference. pp. 620-627. Won best student paper award.

 

•  Sharad Mehrotra, Paul Franzon, Michael Steer, Performance Driven Global Routing and Wiring Rule Generation for High Speed PCBs and MCMs, in Proceedings 1995 Design Automation Confere nce, pp. 36-40.

 

•  Paul Franzon, Andrew Stanaski, Yusuf Tekmen, Sanjeev Banerjia, “System Design Optimization for MCM'', in Proc. 1995 IEEE MultiChip Module Conference .

 

•  S. Mehrotra, P. Franzon, G. Bilbro and M. Steer, CAD tools for Managing Signal Integrity and Congestion Simultaneously, Proc. 1994 Topical Meeting on Electrical Performance of Electrical Packaging, pages 30-32.

 

•  D. Winick, M. Teague, and P. Franzon, Applications of MEMS to Reconfigurable Free Space Optical Interconnect, Proc. NSF Optical Packaging Workshop , Breckenridge CO, August 15-17, 1994.

 

•  S. Mehrotra, P. Franzon and W. Liu, Skew and Delay Minimization of High Speed CMOS Circuits using Stochastic Optimization, Proc. 1994 Custom Integrated Circuits Conference , pp. 45-48.

 

•  S. Mehrotra, P. Franzon and W. Liu, Stochastic OptimizationApproach to Transistor Sizing for CMOS Circuits, Proc.1994 IEEE Design Automation Conference , pp. 36-40.

 

•  M. Sengupta, S. Lipa, P. Franzon, M. Steer, Control of Crosstalk Noise, Proc. 1994 ECTC Conference.

 

•  M.S. Basel, M.B. Steer, and P.D. Franzon, “Hierarchical simulation of high speed digital interconnects using a packaging simulator,'' Proceedings 44th Electronic Components and Technology Conference , May 1994.

 

•  Slobodan Simovich, Sharad Mehrotra, Paul Franzon, Michael Steer, Zaki Rakib and Garrett Simpson, A Signal Integrity Advisor for Automated Packaging Design, in Proc. 1993 IEEE Topical Meeting on Electrical Performance of Electronic Packaging , Monterey CA, October 20--22.

 

•  Todd A. Cook, P.D. Franzon, and Thomas K. Miller III: “LISAS: A Language for Instruction Set Architecture Specification'', Proc. 1993 ICCD Conference , pp. 552-557.

 

•  M. Steer, S. Lipa, and P. Franzon, Experimental characterization of interconnects and discontinuities in thin-film multichip module substrates, in Proc. 1993 IEEE Topical Meeting on Electrical Performance of Electronic Packaging , Monterey CA, October 20--22.

 

•  Paul Franzon, Slobodan Simovich, Sharad Mehrotra, Michael Steer, Macromodels for Generating Signal Integrity and Timing Management Advice for Package Design, in Proc. IEEE 1993 ECTC Conference . pp. 523-529.

 

•  Paul Franzon, Slobodan Simovich, Sharad Mehrotra and Michael Steer, Automatic A-Priori Generation of Delay and Noise Macromodels and Wiring Rules for MCMs, IEEE 1993 MCM Conference.

 

•  Slobodan Simovich and Paul Franzon, A simple method for noise tolerance characterization of digital circuits , Proc. 1993 Great Lakes VLSI Conference .

 

•  Todd A. Cook, Ed Harcourt, Thomas K. Miller III, and Paul D. Franzon: Beharvioral modeling of processors from instruction set specifications, to appear in the Open Verilog International 1993 Conference .

 

•  J. Bowen, D. Bahler, and P. Franzon, Design advice systems for concurrent engineering: A constraint-based approach, NSF Grantees Conference , Charlotte NC, Jan 93.

 

•  P.D. Franzon, S. Simovich, M. Steer, M. Basel, S. Mehrotra, and T.D. Mills, “Tools to aid in Wiring Rule Generation for High Speed Interconnects'', Proc. 1992 Design Automation Conference, pp.466-471.

 

•  P.D. Franzon, M. Mehrotra, S. Simovich, and M. Steer: Automating Design for Signal Integrity}, 1992 IEEE Topical Meeting on Electrical Performance of Electronic Packaging ,Tuscon AZ, Proc. pp.10--13.

 

•  M. Steer and P.D. Franzon: Microwave characterization of thin-film multi-chip module substrates and printed wiring boards accounting for frequency-dependent characteristic impedance , 1992 IEEE Topical Meeting on Electrical Performance of Electronic Packaging , Tuscon AZ , Proc. pp.125-127.

 

•  Dholakia, T.M. Lee, D.L. Bitzer, M.A. Vouk, L. Wang, and P.D. Franzon, An efficient table-driven decoder for one-half rate convolutional codes, Proc. 30th ACM SouthEastCon, pp.116-123.

 

•  E.J. Vardaman and M.W. Hartnett and L.H. Ng and P.D. Franzon, “Cost/performance issues in multichip module packaging'', Proc. Japan Int. Conf. on Microelectronics , 1992.

 

•  Paul Franzon, Sharad Mehrotra, Slobodan Simovich, Michael Steer, “Automating Design for Signal Integrity'', Topical Meeting on Electrical Performance of Electronic Packaging , Tucson , Arizona , April 23, 1991.

 

•  M.B. Steer and P.D. Franzon, “Microwave characterization of thin-film multi-chip module substrates and printed wiring boards accounting for frequency-dependent characteristic impedance,'' Topical Meeting on Electrical Performance of Electronic Packaging , Tucson, Arizona, April 23, 1991.

 

•  M.B. Steer, S.B. Goldberg, G. Rinne, P.D. Franzon, I. Turlik and J.S. Kasten, “Introducing the through-line deembedding procedure, ''1992 IEEE MTT-S International Microwave Symposium Digest ,June 1992.

 

•  Paul Franzon, Michael Steer, Ronald Gyurcsik, Tools and echniques for the Design of High Speed Multichip Modules Proc. Japan IEMT , July, 1991.

 

•  D. Van den Bout, T. Nagle, T. Miller and P. Franzon, The NCSU Design Center, in Proc 1991 Microsystems Educators Conference, July 1991, San Jose CA .

 

•  P.D Franzon and M.B. Steer, Interconnect Modeling and Simulation for High Speed MCM, in Proc. Multichip Module Workshop , March 28th-29th, 1991, pp. 122--129.

 

•  P. Franzon and Michael Steer: Tools and Techniques for the Design of High Speed Multichip Modules , in Proc. Third Annual Electronics Packaging Symposium ,May 13 -14, 1991, Binghamton NY .

 

•  M.S. Basel, M.B. Steer, P.D. Franzon and D. Winkelstein, High Speed Digital System Simulation using Frequency Dependent Transmission Line Network Modeling, 1991 IEEE MTT-S International Microwave Symposium Digest , June 1991.

 

•  S.B. Goldberg, M.B. Steer, and P.D. Franzon, Accurate experimental characterization of three-ports , 1991 IEEE MTT-S International Microwave Symposium Digest , June 1991.

 

•  S.B. Goldberg, M.B. Steer, and P.D. Franzon, Experimental electrical characterization of high speed interconnects, 41st Electronic Components and Technology Conference , May 1991.

 

•  M.B. Steer and P.D. Franzon: Circuit Simulation with Distributed Elements,Workshop on Circuit and Process Simulation, Microelectronics Center of North Carolina , Research Triangle Park, Nov. 6, 1990.

 

•  P. Franzon, et al: CAD Tools for the Automated Design of High Speed Multichip Modules, Proceedings of the 1990 International Packaging Symposium .

 

•  M. Lorenzetti, A. Dalal, and P. Franzon: McYield: A CAD Tool for Functional Yield Projections for VLSI, 1990 International Workshop on Defect and Fault Tolerance in VLSI Systems.

 

•  P. Franzon, D. VanDenBout J. Paulos, T. Miller III, W. Snyder, T. Nagle, and W. Liu: Defect tolerant implementations for feed-forward and recurrent neural networks , Proceedings of 1990 International Conference on Wafer-Scale Integration, January 1990, pages 160-166.

 

•  P. Franzon: Comparison of Reconfiguration Schemes for Defect Tolerant Mesh Arrays, in Proceedings of the 1989 Workshop on Defect Tolerance , Tampa Florida, 22 - 24 October, 1989.

 

•  P.D. Franzon: Yield Modeling for Fault Tolerant VLSI, in the Proceedings of the International Workshop on Systolic Arrays , University of Oxford , England , July 1986.

 

•  P. Franzon and S.K. Tewksbury: `Chip Frame' scheme for reconfigurable mesh-connected arrays , in the Proceedings of the 1987 International workshop on Wafer Scale Integration , Uxbridge England , Sept., 1987.

 

•  L.A. Hornak, S.K. Tewksbury, M. Hatamian, A. Ligtenberg, B. Sugla and P. Franzon: Through-Wafer Optical Interconnects for Multi-Wafer Wafer-Scale Integrated architectures, in the Proceedings of SPIE 86 , San Diego California , August 1986.

 

•  P.D. Franzon: Interconnect Strategies for Fault Tolerant 2D VLSI Arrays , in the Proceedings of the International Conference on Computer Design , ICCD-86, Rye Town NY , October 1986, pp. 230-234.

 

•  K.Eshraghian. R.C.Bryant, A.Dickinson, D.S.Fensom, P.D.Franzon,M.T.Pope, J.E.Rockliff, G.Zyner: The Transform and Filter Brick: A new architecture for signal processing, VLSI 85 , Tokyo Japan , 25-28 August, 1985.