Papers
Papers
Paper Submission Due Date: December 2, 2011
January 31 - February 2, 2012, Osaka, Japan
The IEEE International 3D System Integration Conference (3DIC) will be held at the "Senri Life-Science center" in Osaka on January 31 - February 2, 2012.
This conference combines the previous ASET and IEEE EDS Society sponsored International 3D System Integration Conference, held in Tokyo in 2007 & 2008 and the Fraunhofer and IEEE CPMT sponsored International 3D System Integration Workshop held in 2003 & 2007 in Munich. After the first combined conference in San Francisco 2009, the 2nd IEEE 3D System Integration Conference was held in Munich in 2010. The 3rd conference will be held in Osaka in 2011, rotate to San Francisco in 2012 and then rotate back to Munich in 2013.
3DIC 2011 will cover all 3D integration topics, including 3D process technology, materials, equipment, circuits technology, design and test methodology and applications. The conference invites authors and attendees to submit and interact with 3D researchers from all around the world. Papers are solicited in subject topics, including, but not limited to, the following:
3D Integration Technology. Through Silicon Vias (TSV), wafer thinning, wafer alignment, wafer bonding, wafer dicing, 3D IC process, monolithic 3D integration, heterogeneous 3D integration (e.g. for MEMS, NEMS), capacitive coupling, inductive coupling, multilevel epitaxial growth, etc.
3D IC Circuits Technology. 3D SOC, 3D Memory, 3D Processor, 3D DSP, 3D FPGA, 3D RF and microwave/millimeter wave, 3D analog circuits, 3D biomedical circuits etc.
3D Applications - imaging, memory, processors, communications, networking, wireless, biomedical, MEMS/NEMS etc.
3D Design and Test Methodology. 3D CAD, 3D synthesis, 3D design flows, Signal and power integrity analysis and design in 3D, 3D thermal design and analysis, test and design for test; 3D mechanical stress and reliability design and analysis, etc.
Accepted papers should be submitted on the conference web site: www.3dic-conf.org. Please prepare a 4-8 page IEEE format paper and load it to the web site by December 2. The paper will go through a brief review for appropriateness, before final acceptance.
Information about the IEEE paper format can be found at
http://www.ieee.org/portal/cms_docs/pubs/confpubcenter/pdfs/samplems.pdf
