Organization

2018 Conference Co-Chairs

• Cian Ó Murchú – Tyndall National Institute
• Peter Ramm –  Fraunhofer-EMFT
• Eric Beyne – IMEC
• Pascal Vivet – CEA

Sponsoring Institutions

• Tyndall National Institute – Cork, Ireland
• Fraunhofer EMFT – Munich, Germany
• imec – Leuven, Belgium
• Tohoku University – Sendai, Japan
• North Carolina State University – Raleigh, North Carolina, USA

Sponsoring Organizations

• IEEE EPS

Programme Committee

Dr. Masahiro Aoyagi, National Institute of AIST

Mr. Rolf Aschenbrenner, Fraunhofer IZM

Prof. Muhannad Bakir, Georgia Institute of Technology

Dr. Eric  Beyne, Imec

Dr. Jeffrey Burns, IBM Research

Prof. Kuan-Neng Chen, National Chiao Tung University

Dr. Qianwen Chen, Tsinghua University

Ms. Severine Cheramy, CEA-Leti

Dr. Tae-Je Cho, Samsung

Prof. Rhett Davis, NC State University

Dr. Joeri De Vos, IMEC

Dr. Paul Enquist, Invensas

Mr. Takayuki Ezaki, Sony Semiconductor Solutions Corporation

Dr. Philip Garrou, Microelectronics Consultants of NC

Dr. Soha Hassoun, Tufts University

Dr. Ahmed Jerraya, CEA

Dr. Morihiro Kada, ASET

Dr. Shigeru Kannari, ASET

Dr. Craig Keast, MIT

Prof. Joungho Kim, KAIST

Dr. Hirofumi Kobayashi, ASET

Dr. Mitsumasa Koyanagi, Tohoku University

Prof. Dim-Lee Kwong, Institute of Microelectronics

Dr. Sung Kyu Lim, GATECH

Dr. Patrick Leduc, CEA

Prof. Kangwook Lee, Tohoku University

Dr. Wei-Chung Lo, ITRI

Prof. James Lu, RPI

Mr. Matthew Lueck, RTI International

Dr. Pat Morrow, Intel

Dr. Makoto Motoyoshi, Tohoku-MicroTec Co., Ltd

Prof. Makoto Nagata, Kobe University

Mr. Zvi  Or-Bach, MonolithIC 3D

Mr. Rakesh Patel, Consultant

Mr. Robert Patti, Tezzaron Semiconductor

Dr. Klaus Pressel, Infineon Technologies AG

Dr. Shivam Priyadarshi, Qualcomm Technologies

Dr. Daniel Radack, IDA

Dr. Peter Ramm, Fraunhofer EMFT

Dr. Herb Reiter, eda2asic

Dr. Katsuyuki Sakuma, IBM T. J. Watson Research Center

Prof. Sachin Sapatnekar, University of Minnesota

Dr. Chuan Seng Tan, NTU Singapore

Dr. Dongkai Shangguan, National Centre for Advanced Packaging

Dr. Chuan Seng Tan, Nanyang Technological University

Prof. Tetsu Tanaka, Tohoku University

Dr. Cristina Torregiani, Infineon Technologies AG

Mr. Chih Hang Tung, TSMC

Dr. Geert Van Der Plas, imec

Dr. Dimitris Velenis, imec

Dr. Benedetto Vigna, ST

Mr. Pascal Vivet, MINATEC

Dr. Nagesh Vodrahalli, AllVia, Inc.

Prof. Yuan Xie, UCSB

Dr. Doug Yu, TSMC