2015 3DIC AUG. 31-SEP. 2, 2015 SENDAI, JAPAN / IEEE

Invited Speakers

Invited Speakers



1 Subramanian Iyer University of California at Los Angeles/USA Some Challenges in Scaling 3D ICs to a Broader Application Set
2 Robert Patti Tezzaron Semiconductor/USA Progress in 3D Integrated Circuits
3 Rozalia Beica Yole Development/France 3D Integration: Applications and Market Trends
4 Paul Franzon North Carolina State University/USA Computing in 3D
5 Isao Sugaya Nikon/Japan New Precision Wafer Bonding Technologies for 3DIC
6 Tomoharu Ogita Sony/Japan Technology and Overview of Sony’s 3D Stacked CMOS Image Sensor
7 Gamal Refai-Ahmed Xilinx/USA A Holistic View of Chip-Level Thermal Architecture from Heterogeneous Stacked Dice to System Level in Telecoms Applications
8 Joungho Kim KAIST/Korea Active Si Interposer for 3D IC Integrations