January 31-February 2, 2012, Osaka, Japan

(Conference date and site have been changed from October 3-5, 2011, Tokyo)

3DIC 2011

This conference combines the previous ASET and IEEE EDS Society sponsored International 3D System Integration Conference, held in Tokyo in 2007 & 2008 and the Fraunhofer and IEEE CPMT sponsored International 3D System Integration Workshop held in 2003 & 2007 in Munich. After the first combined conference in San Francisco 2009, the 2nd IEEE International Conference on 3D System Integration was held in Munich in 2010. The 3rd conference will be held in Osaka in 2011, rotate to San Francisco in 2012 and then rotate back to Munich in 2013.

3DIC 2011 will cover all 3D Integration topics, including 3D process technology, materials, equipment, circuits technology, design and test methodology and applications. The conference invites authors and attendees to submit and interact with 3D integration researchers from all around the world.

The 3rd IEEE International 3D System Integration Conference (3DIC 2011) will be held at the "Senri Life-Science center" in Osaka on January 31st - February 2nd, 2012. Osaka is located in the western part of Japan and more than 500 Km away from the area damaged by the March 11 earthquake and tsunami, and the nuclear power plant in Fukushima. Therefore, Osaka has not been damaged by the earthquake, tsunami and Fukushima nuclear plant accident at all. Detailed program information will be available soon. For subscription details please go to www.3dic-conf.org/registration/.